PEP 3510A Specifications
Process
| Dual Chamber Single Wafer Photoresist Removal System | |
|---|---|
| Applications | Bulk Ash, HDIS, Descum |
| Throughput | 120 WPH streaming (1.2μm blanket soft-baked resist ashed to endpoint) |
| Ash Rate | ≥3.5μm/min. |
| Uniformity | Within-Wafer ≤5.0% (1σ) Wafer-to-Wafer ≤3.0% (1σ) |
| Gases | O2, N2 and N2/H2 typical gases |
| Temperature Range | 100–300°C |
| Microwave Range | 0–1.2 kW, 2.45 GHz |
| Particles | < 0.05/cm2, ≥ 0.2μm |
Facilities Information
| Wafer Size | 6–8 inch (150–200mm) |
| Footprint | 48" (122cm ) W X 63" (160cm ) D X 83" (210cm) |
| Gas Box Configuration | 2 gas boxes (1 per chamber) with 3 or 4 MFC’s per box |
| Electrical | 200–240 VAC, 150 Amp breaker, 3 Phase, 50/60 Hz, WYE configuration |
| Air Exhaust | 200 CFM per chamber |
| Cooling Water | 1.5 GPM per chamber |
| Vacuum | >250 CFM per chamber >10 slpm @ 25" Hg for robot |
Note: Novellus guarantees that the films will meet the listed specifications when deposited using standard Novellus process conditions and measured according to Novellus recommended procedures.
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