Concept Two Altus Specifications

PRODUCT SPECIFICATIONS (Full Coverage and MOER Processes)

	Low Temperature Plug Fill	Low Stress Composite Interconnect	Pure Interconnect
Film Thickness Range	1,000–12,000Å	1,000–12,000Å	1,000–12,000Å
Within-Wafer Thickness Uniformity Full coverage MOER	≤2.0% (1σ) ≤3.0% (1σ)	≤2.0% (1σ) ≤3.0% (1σ)	≤2.0% (1σ) ≤3.0% (1σ)
Wafer-to-Wafer Thickness Reproducibility	≤2.0% (1σ)	≤2.0% (1σ)	≤2.0% (1σ)
Film Coverage at 194mm Diameter Full coverage MOER	100% >85% of normal thickness (SEM cross section)	100%	100%
Deposition on Wafer Bevel Full coverage MOER	yes no	yes no	yes no
Manufacturability, Cp (spec. limit of ± 10%)	2.0	2.0	2.0
Typical Film Stress	9–13 E9 dynes/cm2	5–10 E9 dynes/cm2	3–10 E9 dynes/cm2
Step Coverage	≥ 90% (4:1 AR)	not applicable	not applicable
Surface Roughness (peak to valley)	<15%	<15%	<15%
Layer Resistance	9–12μΩ-cm	9–12μΩ-cm	9–12μΩ-cm
Particle density (≥0.16μm)	≤0.05d/cm2	≤0.05d/cm2	≤0.05d/cm2

Standard Novellus Deposition Parameters
Pressure	40 torr	40 torr	40 torr
Temperature	415–445°C	390–475°C	475°C
Deposition Rate	2,000–3,000Å/min	1,500–4,000Å/min	1,500–4,000Å/min

Note: Novellus guarantees that the films will meet the listed specifications when deposited using standard Novellus process conditions and measured according to Novellus recommended procedures.

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